By Topic

Effects of addition of nano-scale alumina and silica fillers on thermal conductivity and dielectric strength of epoxy / alumina microcomposites

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Okazaki, Y. ; Dept. of Electr. Eng. & Electron., Kyushu Inst. of Technol., Kitakyushu, Japan ; Kozako, M. ; Hikita, M. ; Tanaka, T.

The aim of this study is to improve both thermal conductivity and electrical insulation properties of epoxy based composites using nanocomposite techniques. This paper deals with the effects of adding nano-scale alumina and silica fillers on thermal conductivity and dielectric strength of epoxy/alumina micro-composites. Two kinds of specimens were prepared with containing nano-fillers as a nanocomposite or a nano/micro composite. Also, two kinds of specimens without fillers or with 30 vol% of micro-scale alumina fillers as base materials. Average particle sizes of the alumina and silica nano-fillers used were 14 nm and 12 nm, respectively. The micro-fillers used were alumina particle of spherical shape, and its average particle size was about 10 μm. Nano-filler content was 5 wt% in each specimen. Thermal conductivity was evaluated by the laser flash method. AC dielectric strength was measured by a sphere-plane electrode system immersed in insulating liquid. Cracked surfaces were observed with the scanning electron microscope to check the state of nano-fillers dispersion. It was elucidated that an improvement effect of each nano-filler addition is seen on both thermal conductivity and dielectric strength.

Published in:

Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on

Date of Conference:

4-9 July 2010