A high-speed hybrid-integrated two-channel laser diode (LD) array module has been fabricated using a silica-based planar lightwave circuit (PLC) platform. A laser diode array was flip-chip bonded on a PLC platform using AuSn solder bumps. The module showed a wide 3 dB bandwidth of 10 GHz, which is wide enough for operation at 10 Gbit/s
Published in:
Electronics Letters
(Volume:32
,
Issue:
24
)
Date of Publication: 21 Nov 1996