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A package design technique for size reduction of implantable bioelectronic systems

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1 Author(s)
Soma, M. ; Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

Several substrate and package design techniques for minimizing the overall size of bioelectronic systems, especially those that will be implanted for in vivo studies, are presented. The emphasis is on a new capacitor attachment and a new double-substrate design that have been successfully applied to the packaging of an implantable auditory prosthesis. The entire procedure for this case is described and compared with standard techniques to illustrate the advantages of this new approach in packaging.

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Biomedical Engineering, IEEE Transactions on  (Volume:37 ,  Issue: 5 )