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A fast 3-D eigenvalue solver for finite-element-based analysis of multilayered integrated circuits

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4 Author(s)
Jongwon Lee ; School of Electrical and Computer Engineering, Purdue University, 465 Northwestern Avenue, West Lafayette, IN, USA ; Venkataramanan Balakrishnan ; Cheng-Kok Koh ; Dan Jiao

A fast complex-valued 3-D eigenvalue solver for finite-element-based analysis was developed to solve arbitrarily-shaped multilayered integrated circuits. Numerical results have demonstrated the accuracy and efficiency of the proposed solver.

Published in:

2010 IEEE Antennas and Propagation Society International Symposium

Date of Conference:

11-17 July 2010