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Simple compact diode-laser/microlens packaging

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3 Author(s)
Liau, Z.L. ; Lincoln Lab., MIT, Lexington, MA, USA ; Tsang, D.Z. ; Walpole, J.N.

A technique has been demonstrated in which the precisely polished substrate of a microlens is directly attached to the front face of a diode laser and heatsink to form a compact stable package. An experimental package using mass-transported GaP spherical microlenses and InGaAs-AlGaAs ridge-waveguide lasers (0.98-μm wavelength) showed a well-collimated beam with a near diffraction-limited 0.7° divergence. The high-index microlens and the favorable lens configuration showed high tolerance for alignment errors in the optical-path-difference and Strehl-ratio calculations

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Quantum Electronics, IEEE Journal of  (Volume:33 ,  Issue: 3 )