Cart (Loading....) | Create Account
Close category search window

High-density, low-power optical interconnects for computing systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Nakagawa, S. ; IBM Res. - Tokyo, Yamato, Japan

Multicore architecture has been widely exploited in computing systems to increase performance under power-constrained environment, and realized the highest-performance supercomputers. Multicore systems are high-level integration of many power-efficient microprocessors with high-bandwidth interconnects, which requires high data rate per channel, high channel counts, or both. Optical transmission is inherently suited for high-bandwidth interconnects with low propagation loss as well as low dispersion, and the latest top-performance supercomputers have exploited many optical channels. Recent advancements in optical interconnect technologies have demonstrated high-density packaging as well as low-power dissipation of high-speed optical channels, both of which are superior to electrical counterparts.

Published in:

Photonics Society Summer Topical Meeting Series, 2010 IEEE

Date of Conference:

19-21 July 2010

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.