By Topic

Low-cost UAV-based thermal infrared remote sensing: Platform, calibration and applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Hu Sheng ; Dept. of Electron. Eng., Dalian Univ. of Technol., Dalian, China ; Haiyang Chao ; Coopmans, C. ; Jinlu Han
more authors

Thermal infrared (TIR) remote sensing is recognized as a powerful tool for collecting, analyzing and modeling of energy fluxes and temperature variations. Traditional aircraft, satellite or ground TIR platforms can provide valuable regional-scale environmental information. However, these platforms have limitations, such as expensive cost, complicated manipulation, etc. In comparison, small unmanned aircraft systems (UAS) have many advantages in TIR remote sensing applications over traditional platforms. In this paper, a low-cost UAV-based TIR remote sensing platform: AggieAir-TIR is introduced. AggieAir-TIR is a small, low-cost, flexible TIR remote sensing platform, which was accomplished at the Center for Self Organizing and Intelligent Systems (CSOIS) in Utah State University (USU). The detailed introduction of AggieAir-TIR remote sensing platform is provided in the paper. Furthermore, a low-cost TIR imaging camera calibration experiment is designed, and the calibration results are provided. Based on this AggieAir-TIR remote sensing platform, many remote TIR image data collection and analysis projects can be effectively implemented.

Published in:

Mechatronics and Embedded Systems and Applications (MESA), 2010 IEEE/ASME International Conference on

Date of Conference:

15-17 July 2010