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Over the last decade, integrated EDX (Energy Dispersive X-ray) systems on in-line SEM review tools have become the main method of providing the fab with a fast and efficient way to identify and reduce defects and yield limiting sources. As device sizes keep scaling down, the defects of interest size also becomes smaller, increasing the effective time needed for an accurate spectrum acquisition. In order to keep up with the demand for high defect analysis rates in the production fab, material analysis (MA) must also be done faster, even on very small (<;50 nm) particles. In this paper, the capabilities and limitations of each analysis technology will be discussed as well as the performance of the combination of advanced EDX and WDX systems. In addition we will describe a method to resolve challenging MA cases by using a Wavelength Dispersive X-ray (WDX) system integrated side by side with an advanced EDX system. The discussion will include four case studies demonstrating the use of these advanced MA technologies in an advanced logic fab.
Date of Conference: 11-13 July 2010