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Process tool cleanliness for clean manufacturing

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1 Author(s)
V. K. F. Chia ; Balazs Nano Analysis, 46409 Landing Parkway, Fremont, CA 94538 USA

Wafer tool cleanliness specifications are generally accepted for various processes and technology nodes. However, the material and component cleanliness required to meet these wafer tool cleanliness is vague. One reason is the lack of uniformly accepted parts cleanliness tests. This paper reviews and recommends test methods for determining the cleanliness of coupons, first articles and production parts.

Published in:

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Date of Conference:

11-13 July 2010