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Significant financial profits recognized by reducing the wafer edge exclusion ring in order to increase extra productive dies as well as enhance the yield of the edge-most region of the semiconductor wafer. A method to determine distance of structure from a wafer edge is implemented using software called HandiExclusion v.3 and template named HandieRad. The wafer is put onto the template to get H degree measurement. Program then convert the H degree to a distance measurement from the wafer edge. Scanning Electron Microscope (SEM) Tap-Center Technique used to move precisely at the target distance.