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Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration

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7 Author(s)
Niitsu, K. ; Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan ; Sugimori, Y. ; Kohama, Y. ; Osada, K.
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This paper discusses analysis and techniques for mitigating interference of an inductive-coupling inter-chip link. Electromagnetic interference from power/signal lines and to SRAM circuits was simulated and measured. In order to verify the interference, test chips were designed and fabricated using 65-nm CMOS technology. The measurement results revealed that: 1) interference from power lines depends on the shape of the power lines; 2) interference from signal lines can be canceled by increasing transmitter power by only 9%; and 3) interference with SRAM circuits is less important than other issues under ordinary conditions. Based on the measurement results, interference mitigation techniques are proposed and investigated.

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Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:19 ,  Issue: 10 )