By Topic

Reliability of the laminate from advanced COPNA-resin/E-glass fabrics system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Nawa, K. ; Res. & Dev. Center, Sumitomo Metal Ind. Ltd., Amagasaki, Japan ; Ohkita, M.

Reliability of the advanced COPNA-resin laminate which exhibited high glass transition temperature (Tg) at 255°C, low coefficient of thermal expansion (CTE) at 5-7 ppm (xy-axis) and at 29 ppm (x-axis) was evaluated by temperature-humidity-bias (THB) test, pressure-cooker (PC) test, heat-shock test, heat-cycle test, and conductive anodic filaments (CAF) test. The laminate exhibited higher reliability than the FR-4 graded epoxy-resin laminate in every test, and exhibited higher reliability than the bismaleimide-triazine resin laminate in the THB test, heat-shock test, and heat-cycle test. The high reliability of the advanced COPNA-resin system is considered to be due to its high Tg and small CTE. In this paper, low CTEs of the advanced COPNA-resin laminate are also theoretically studied by using a model for uni-axially reinforced composites

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 1 )