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FDTD analysis of the electrical performance for interconnection lines in multichip module (MCM) with perforated reference planes

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2 Author(s)
Zhao, J. ; Dept. of Electron. Eng., Shanghai Jiaotong Univ., China ; Zhengfan Li

A finite difference time domain (FDTD) approach is demonstrated for analysis of the electrical performance of interconnection lines and the extraction of their equivalent circuit parameters in a multichip-module (MCM) with perforated reference planes. By making an equivalence between uniform and nonuniform interconnection lines and an equivalence between nonuniform interconnection lines and actual physical interconnection lines' structure, the equivalent distributed circuit parameters and transmission characteristic parameters can be obtained from the fields calculated by the FDTD method. The results are compared with those obtained by other methods. The dispersive characteristics of such interconnection lines with perforated reference planes and the coupling between interconnection lines on different layers is also studied in this paper

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:20 ,  Issue: 1 )

Date of Publication:

Feb 1997

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