Close category search window
 

Electromagnetic modelling and transient simulation of interconnects in high speed VLSI circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Zhu, Z. ; State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China ; Hong, W. ; Chen, Y. ; Wang, Y.

A new technique is implemented in the method of lines to extract the capacitance and inductance matrices of a multiconductor interconnection embedded in a multilayered lossy dielectric region. Using the concept of equivalent transmission lines the electromagnetic problem is turned into a simple network problem. This technique avoids the problem associated with Green's function in the multilayered region and makes the deduction process almost independent of the number of dielectric layers and conductors. Based on the extracted parameters a bilevel waveform relaxation method is used to compute the transient response of such a system terminated in arbitrary loads

Published in:
Microwaves, Antennas and Propagation, IEE Proceedings  (Volume:143 ,  Issue: 5 )

Date of Publication: Oct 1996

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.