Cart (Loading....) | Create Account
Close category search window
 

Two step optimized process for scanning tunneling microscopy tip fabrication

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Bastiman, F. ; Department of Electronic and Electrical Engineering, University of Sheffield, Mappin Street, Sheffield S1 3JD, United Kingdom ; Cullis, A.G. ; Hopkinson, M. ; Briston, K.J.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1116/1.3359608 

Fabrication of ultrasharp tips for scanning tunneling microscopy is inherently a two-step procedure, typically involving an etch process and postetch cleaning. From the myriad of etching parameters available in literature a procedure is presented that allows quantitative optimization and the routine production of tips with 3–10 nm radius of curvature. These ideally shaped tips require final oxide removal. Utilizing a custom designed e-beam heater element, oxide removal without localized melting is realized.

Published in:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures  (Volume:28 ,  Issue: 2 )

Date of Publication:

Mar 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.