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K-band near-hermetic surface mount package using liquid crystal polymer for high power applications.

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2 Author(s)
C. Chen ; University of California, Davis, United States ; A. Pham

We present the design and development of a K-band surface mount package for ∼10 Watt DC power dissipation devices. The package forms a near hermetic cavity enclosed by liquid crystal polymer (LCP) and copper. The measured junction temperature of ∼10 Watt DC power dissipation is 143.9oC with the base plate at 80oC. The package feedthrough achieves a measured insertion loss of ∼ 0.5 dB to 0.8 dB at K-band frequencies.

Published in:

Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International

Date of Conference:

23-28 May 2010