By Topic

K-band near-hermetic surface mount package using liquid crystal polymer for high power applications.

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Chen, C. ; University of California, Davis, United States ; Pham, A.

We present the design and development of a K-band surface mount package for ∼10 Watt DC power dissipation devices. The package forms a near hermetic cavity enclosed by liquid crystal polymer (LCP) and copper. The measured junction temperature of ∼10 Watt DC power dissipation is 143.9oC with the base plate at 80oC. The package feedthrough achieves a measured insertion loss of ∼ 0.5 dB to 0.8 dB at K-band frequencies.

Published in:

Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International

Date of Conference:

23-28 May 2010