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The next generation of small form factor (SFF) microsystem technologies can only keep up with increased functionality and performance demands by using the third dimension. 3D integration technologies can be grouped into following distinct technology approaches: (i) 3D-monolithic IC integration, (ii) 3D stacking of IC-dies, wafers and packages, and (iii) 3D integrated packaging. This paper provides an overview on the various 3D integration and enabling technologies as well as the associated challenges that exist for SFF wireless system implementation with optimum cost and performance.
Date of Conference: 23-28 May 2010