Referenced Items are not available for this document.
Three commercially available, silver filled, snap cure isotropically electrically conductive adhesives for surface mount applications were selected for study. Fundamental material characterizations were conducted on these materials, including thermal analysis (DSC, TGA, and TMA), rheological, and dynamic mechanical analyses. Microstructural investigations (SEM, TEM, Auger) were performed to identify the silver flake size, distribution, and contact morphology. These analyses were related to the cure process and electrical conduction mechanisms of ICAs
Published in:
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Date of Conference: 28-31 May 1996
- Page(s):
- 571 - 577
- Meeting Date :
- 28 May 1996-31 May 1996
- ISSN :
- 0569-5503
- Print ISBN:
- 0-7803-3286-5
- INSPEC Accession Number:
- 5418211
- Conference Location :
- Orlando, FL
- Digital Object Identifier :
- 10.1109/ECTC.1996.551418
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
