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Coupling Simulation of Flow Field and Temperature Field in Mold Filling Process Based on ANSYS Software

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2 Author(s)
Jin Changzhong ; Sch. of Mech. Eng., Tianjin Univ. of Technol., Tianjin, China ; Chen Ling

Based on finite element method(FEM), with general simulation software ANSYS FLOTRAN-CFD module as the platform, using three-dimensional SOLA-VOF method, set the velocity, pressure and temperature boundary conditions and initial conditions reasonably, simulate temperature field, flow field and free surface of Mold Filling process. To simulate the flow of molten metal more factually, mesh dividing method that suited the Liquid simulation was studied, and important thermophysical properties of viscosity and density used the form of function change with temperature. The least square method was used to fit viscosity and density function and these functions were given to boundary conditions. Analyzed the relationship between temperature field and flow field according to simulation result, and get the conclusion that the node temperature depends on filled state of elements attached. At the same time, Get the temperature field at the end of mold filling process, which provides accurate initial temperature field for temperature field and thermal stress field simulation of solidification process. Also provide valuable reference for numerical simulation of Mold Filling process and solidification process of similar part.

Published in:

Information and Computing (ICIC), 2010 Third International Conference on  (Volume:4 )

Date of Conference:

4-6 June 2010