By Topic

Test-architecture optimization for TSV-based 3D stacked ICs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Brandon Noia ; Dept. Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA ; Sandeep Kumar Goel ; Krishnendu Chakrabarty ; Erik Jan Marinissen
more authors

Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D stacked ICs implemented using Through-Silicon Vias (TSVs) technology. We consider 3D-SICs with both fixed given and yet-to-be-designed test architectures on each die and show that both corresponding problem variants are NP-hard. We next present mathematical programming techniques to derive optimal solutions for these problems. Experimental results for three handcrafted 3D-SICs of various SOCs from the ITC'02 SOC test benchmarks show that compared to the baseline method of sequentially testing all dies in a stack, the proposed solutions can achieve up to a 57% reduction in test time. We also show that increasing the number of test pins provides a greater reduction in test time compared to an increase in the number of TSVs. Furthermore, it is shown that 3D stacks with large and complex dies at lower layers require less test time than stacks with complex dies at higher layers.

Published in:

2010 15th IEEE European Test Symposium

Date of Conference:

24-28 May 2010