By Topic

Low-cost signature test of RF blocks based on envelope response analysis

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Barragan, M.J. ; Centro Nac. de Microelectron., Univ. de Sevilla, Sevilla, Spain ; Fiorelli, R. ; Vazquez, D. ; Rueda, A.
more authors

This paper presents a novel and low-cost methodology that can be used for testing RF blocks embedded in complex SoCs. It is based on the detection and analysis of the two-tone response envelope of the device under test (DUT). The response envelope is processed to obtain a simple digital signature sensitive to key specifications of the DUT. The analytical basis of the proposed methodology is demonstrated, and a proposal for its implementation as a built-in test core is discussed. Finally, practical simulation examples show the feasibility of the approach.

Published in:

Test Symposium (ETS), 2010 15th IEEE European

Date of Conference:

24-28 May 2010