By Topic

Proposal and Performance Analysis of Normally Off  \hbox {n}^{++} GaN/InAlN/AlN/GaN HEMTs With 1-nm-Thick InAlN Barrier

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

19 Author(s)
Jan Kuzmik ; Institute for Solid State Electronics, Vienna University of Technology, Vienna, Austria ; Clemens Ostermaier ; G. Pozzovivo ; Bernhard Basnar
more authors

Design considerations and performance of n++ GaN/InAlN/AlN/GaN normally off high-electron mobility transistors (HEMTs) are analyzed. Selective and damage-free dry etching of the gate recess through the GaN cap down to a 1-nm-thick InAlN barrier secures positive threshold voltage, while the thickness and the doping of the GaN cap influence the HEMT direct current and microwave performance. The cap doping density was suggested to be 2 × 1020 cm-3. To screen the channel from the surface traps, the needed cap thickness was estimated to be only 6 nm. Design is proved by an experiment showing a constant value of the HEMT dynamical access resistance, while a single-pulse experiment indicated almost collapse-free performance. On the other hand, it is found that the n++ GaN cap does not contribute to the HEMT drain current conduction, nor does it provide a path for the off-state breakdown. HEMTs with a gate length of 0.25 μm and a 4-μm source-to-drain distance show a drain-to-source current of 0.8 A/mm, a transconductance of 440 mS/mm, a threshold voltage of ~0.4 V, and a cutoff frequency of 50 GHz. A thin and highly doped GaN cap is also found to be suitable for the processing of normally on HEMTs by adopting the nonrecessed gate separated from the cap by insulation.

Published in:

IEEE Transactions on Electron Devices  (Volume:57 ,  Issue: 9 )