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Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting Diodes

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6 Author(s)
Ray-Hua Horng ; Department of Electro-Optical Engineering, National Cheng Kung University, Tainan, Taiwan ; Jhih-Sin Hong ; Yu-Li Tsai ; Dong-Sing Wuu
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To improve heat dissipation of sapphire-based LEDs, we develop a new LED package with a dual heat spreader design. The first heat spreader is a cup-shaped copper sheet, which was directly contacted with sapphire to enhance heat dissipation of the chip itself. The second heat spreader is the die-bonding material of diamond-added AgSnCu solder and a high thermal conductive metal-core printed circuit board (MCPCB), where the conventional dielectric layer was replaced with a thin diamond-like layer. Characterization results demonstrate that the diamond-added composite solder is useful in reducing LED thermal resistance, thus avoiding the thermal accumulation phenomenon. In addition, a LED packaged on the new MCPCB exhibits smaller total thermal resistance and larger light output power.

Published in:

IEEE Transactions on Electron Devices  (Volume:57 ,  Issue: 9 )