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Capturing intrinsic impact of low-k dielectric stacks and packaging materials on mechanical integrity of Cu/low-k interconnects

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12 Author(s)
Furusawa, T. ; Renesas Technol. Corp., Ibaraki, Japan ; Goto, K. ; Izumitani, J. ; Matsuura, M.
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We present a methodology for capturing the intrinsic impact of both low-k dielectric stacks and packaging materials on the mechanical integrity of Cu/low-k interconnects. This drastically reduces the time and cost of sample fabrication and reliability tests and provides short-cycle feedback for both low-k and packaging materials development. Furthermore, this methodology is applicable for all types of packaging, from low-cost QFPs to high-performance Pb-free FCBGAs.

Published in:

Interconnect Technology Conference (IITC), 2010 International

Date of Conference:

6-9 June 2010