Skip to Main Content
The microelectronic industry has arrived at a crossroads. There is the challenge of continued Moore's Law scaling and the ever-growing consumer demand for smaller, faster electronics with extended and new functionalities. 3D integration is a promising and fast-growing field that addresses the convergence of Moore's Law and more than Moore. 3D integration offers a path for higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction. Through this emerging field, new and improved technologies and integration schemes will be necessary to meet the associated manufacturing challenges; this paper describes the advantages of 3D integration, enabling technologies & the driver applications.
Date of Conference: 2-4 June 2010