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This paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and electromagnetic interference (EMI) managements. At the same time, the packaging technique is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid integration of the power dies, one on top of the other, into a 3-D power-chip-on-chip configuration. Due to this structure, the power dies can directly be inserted within electrical plates, with the whole structure emulating a bus-bar-like power module. This paper presents the characteristics and the benefits of this approach. Then, it focuses on the practical characterizations of two prototypes having their active components packaged with the presented technique: a buck converter structure and a full-bridge single-phase diode rectifier. Both of them are based on double-sided thermal cooling, and electrothermal contacts are obtained by pressure. The prototypes exhibit great performances while offering really reduced parasitic and EMI coupling.