By Topic

Cu wire bond reliability improvement through focused heat treatment after bonding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yow Kai Yun ; Freescale Semicond. Malaysia Sdn. Bhd., Petaling Jaya, Malaysia ; Eu Poh Leng

Currently, there is a great interest in applying copper material to wire bonding of fine pitch assembly packaging, particularly for cost saving purposes. However, the hardness property of copper is harder compared to the conventional gold wire. The hardness factor of copper, coupled with the work hardening effect of the USG power and force during wire bonding, is a major cause for bond pad crack and pad cratering, especially on sensitive pad devices. Known methods to soften the FAB has been evaluated and discussed. Softening the FAB has proved to play a role in decreasing the bond pad cratering. However, it does not resolve the problem completely. The proposed solution is to introduce heat after wire bonding to enhance the intermetallic adhesion strength between the copper to the Al bond pad.

Published in:

Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International

Date of Conference:

4-6 Nov. 2008