We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Fast panorama stitching for high-quality panoramic images on mobile phones

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yingen Xiong ; Nokia Res. Center, Palo Alto, CA, USA ; Pulli, K.

This paper addresses the problem of creating high-resolution and high-quality panoramic images from long image sequences with very different colors and luminance in source images. A fast stitching approach is proposed for combining a set of source images into a panoramic image using little memory, and implemented on mobile phones. In this approach, color correction reduces color differences of source images and balances colors and luminance in the whole image sequence, dynamic programming finds optimal seams in overlapping areas between adjacent images and merges them together, and image blending further smoothens color transitions and hides visible seams and stitching artifacts. A sequential panorama stitching procedure constructs panoramic images. The advantages include fast processing speed using dynamic programming for optimal seam finding, reducing memory needs by using the sequential panorama stitching, and improved quality of image labeling and blending due to the use of color correction. The approach has been tested with different image sequences and it works well on both indoor and outdoor scenes.

Published in:

Consumer Electronics, IEEE Transactions on  (Volume:56 ,  Issue: 2 )