By Topic

New electrical modeling approach for simultaneous switching noise for high-performance packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kato, K. ; Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan ; Miura, M. ; Ito, K. ; Yamaji, Y.
more authors

Efficient package modeling is required-to predict a package electrical performance such as simultaneous switching noise (SSN) at an early design stage for high-performance packages. This Paper describes a new modeling approach for SSN applicable to various package structures. The efficient and synthetic modeling approach which we call “segment model” was constructed on the basis of the ratio of signal-to-power/ground counts for both the inner leads and outer leads. To verify the validity of the segment model, SSN induced in ceramic land grid array (C-LGA) with a socket was measured by an LSI tester and the result was compared with simulation data

Published in:

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Date of Conference:

28-31 May 1996