New electrical modeling approach for simultaneous switching noise for high-performance packages

Efficient package modeling is required-to predict a package electrical performance such as simultaneous switching noise (SSN) at an early design stage for high-performance packages. This Paper describes a new modeling approach for SSN applicable to various package structures. The efficient and synthetic modeling approach which we call "segment model" was constructed on the basis of the ratio of signal-to-power/ground counts for both the inner leads and outer leads. To verify the validity of the segment model, SSN induced in ceramic land grid array (C-LGA) with a socket was measured by an LSI tester and the result was compared with simulation data.