Cart (Loading....) | Create Account
Close category search window
 

Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Linz, T. ; Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany ; von Krshiwoblozki, M. ; Walter, H.

This paper presents a new technology to connect electronic modules with textile circuits in a cost efficient and reliable way. Non-conductive thermoplastic polyurethane adhesive is applied to bond a test module onto the fabric with different types of conductive circuits. The adhesive is melted at a high temperature and mechanically fixed by subsequent cooling. The technology even allows contacting isolated conductors without having to remove the isolation in a separate step. Extensive temperature cycling, wash cycling and humidity tests have been carried out and it has been shown that the assembly is reliable under textile typical stress. At the end the paper demonstrates how sensors for body monitoring can benefit from this new technology.

Published in:

Body Sensor Networks (BSN), 2010 International Conference on

Date of Conference:

7-9 June 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.