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Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution

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3 Author(s)
Linz, T. ; Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany ; von Krshiwoblozki, M. ; Walter, H.

This paper presents a new technology to connect electronic modules with textile circuits in a cost efficient and reliable way. Non-conductive thermoplastic polyurethane adhesive is applied to bond a test module onto the fabric with different types of conductive circuits. The adhesive is melted at a high temperature and mechanically fixed by subsequent cooling. The technology even allows contacting isolated conductors without having to remove the isolation in a separate step. Extensive temperature cycling, wash cycling and humidity tests have been carried out and it has been shown that the assembly is reliable under textile typical stress. At the end the paper demonstrates how sensors for body monitoring can benefit from this new technology.

Published in:

Body Sensor Networks (BSN), 2010 International Conference on

Date of Conference:

7-9 June 2010