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LED is called the fourth generation of lighting, which has already been widely used in display and illumination devices. The junction temperature has directly influence upon the life time and reliability of high-power LED, so keeping the junction temperature of LED is a key issue. A method researching radiators based on finite element analysis was introduced. In this paper, the heat performance of LED COB (chip on board) packaging was studied. The radiating model of LED street lamp with a radiator was introduced, and simulated the changing of parameters of radiator by ANSYS.