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An efficient technique for accurate modeling and simulation of substrate coupling in deep micron mixed-signal IC's

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2 Author(s)
Gholam Reza Karimi ; Department of Electrical Engineering, Faculty of Engineering, Razi University 67149, Kermanshah, Iran ; Ebrahim Akbari

Substrate noise in integrated circuits is a major impediment to mixed-signal integration. Accurate simulation is therefore, needed to investigate the generation, propagation, and impact of substrate noise. In this paper, we introduce novel substrate noise estimation and describe a fast and accurate simulator for modeling substrate coupling noise in mixed-signal RF IC design. Using a three-dimensional finite element method for extraction of substrate parasitic elements is developed.

Published in:

2010 International Conference on Electronic Devices, Systems and Applications

Date of Conference:

11-14 April 2010