Referenced Items are not available for this document.
To transfer a manufacturing process technology from one wafer fab to another fabrication plant is a complex exercise in today's world of semiconductor. The fabrication of a semiconductor component, depending on the product type, requires a series of diffusion, photo-etch and metallization among other processes.
Published in:
Electronic Devices, Systems and Applications (ICEDSA), 2010 Intl Conf on
Date of Conference: 11-14 April 2010
- Page(s):
- 159 - 164
- Print ISBN:
- 978-1-4244-6629-0
- INSPEC Accession Number:
- 11412797
- Conference Location :
- Kuala Lumpur
- Digital Object Identifier :
- 10.1109/ICEDSA.2010.5503083
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
