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Phase-change memory alloys based on germanium, antimony, and tellurium with SiO2 nanophase dielectric inclusions are investigated for material and electrical properties. The new alloys are prepared by cosputtering with a SiO2 target creating nanophase dielectric inclusions. The addition of the dielectric inclusions significantly increases the crystallization temperature without affecting the required programming current. In memory device configurations, the nanocomposite alloys exhibit a ten-year data retention above 200°C and a cycle life greater than 1 × 107 cycles while maintaining the SET programming speed of 250 ns.