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Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI

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4 Author(s)
In-Kui Cho ; Electron. & Telecommun. Res. Inst. (ETRI), Daejeon, South Korea ; Jae-Hoon Yun ; Myung-Yung Jeong ; Hyo-Hoon Park

This paper describes a new optical link system which consists of a metal optical bench, a module printed circuit board, a driver/receiver integrated circuit, a vertical-cavity surface-emitting laser/photo diode (VCSEL/PD) array, and an optical link block with plastic optical fibers for reducing electromagnetic interference (EMI) noise. For the optical interconnection between the light-sources and detectors, an optical wiring method whose distinctive features include the absence of EMI noise and easy assembly is proposed. The results clearly demonstrate that the use of an optical wiring method can provide robust, cost-effective assembly and easy-repair. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:33 ,  Issue: 3 )