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Analysis of carbon nanotube based Through Silicon Vias

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5 Author(s)
Kannan, Sukeshwar ; Univ. of Alabama, Tuscaloosa, AL, USA ; Gupta, Anurag ; Kim, B.C. ; Mohammed, F.
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In this paper we have provided analysis of carbon nanotube (CNT) based Through Silicon Vias (TSVs) for package interconnects. The package interconnects are fundamental bottlenecks to achieving high performance and reliability. We have provided electrical modeling and performed simulations on TSV with copper and carbon nanotubes. The results from the CNT-based TSVs were greatly superior to conventional vias with copper.

Published in:

Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

Date of Conference:

1-4 June 2010