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The following topics are dealt with: flip chip packaging; 3D-TSV interconnection; Pb-free solder; intermetallic compounds; optical interconnect; fiber optics; wafer level packaging; wire bonding; bonding interconnect; solder joint reliability; TSV based RF devices; filter; high-power laser; LED; RF packaging; 3D packaging; MEMS technology; nanotechnology; bioelectronics; 3D manufacturing; nanoelectronics; BGA; and chip package interaction.

Published in:

Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

Date of Conference:

1-4 June 2010

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