Cart (Loading....) | Create Account
Close category search window
 

[Copyright notice]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.

The following topics are dealt with: flip chip packaging; 3D-TSV interconnection; Pb-free solder; intermetallic compounds; optical interconnect; fiber optics; wafer level packaging; wire bonding; bonding interconnect; solder joint reliability; TSV based RF devices; filter; high-power laser; LED; RF packaging; 3D packaging; MEMS technology; nanotechnology; bioelectronics; 3D manufacturing; nanoelectronics; BGA; and chip package interaction.

Published in:

Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

Date of Conference:

1-4 June 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.