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Photo-patternable non-conductive adhesives (NCAs) for electronic packaging applications

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4 Author(s)
Il Kim ; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, South Korea ; YoungOok Cho ; Jin-Baek Kim ; Kyung-Wook Paik

Photo-patternable NCAs have been newly developed. The new photo-patternable and thermo-curable NCAs were coated on a wafer and selectively exposed to deep ultra violet (UV). Without post exposure bake, the final products on exposed area were dissolved into a sodium carbonate solution and those on unexposed area were not dissolved. As a result, the new NCAs on a wafer were patterned without curing. After a photo-lithography, the wafer with patterned NCA was singulated and the diced chips were flip chip assembled on flexible printed circuit boards (FPCBs). Flip chip assembly using the new photo-patternable NCAs showed the same stable contact resistance and adhesion strength as conventional NCA flip chip assembles.

Published in:

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

Date of Conference:

1-4 June 2010