Cart (Loading....) | Create Account
Close category search window
 

Hot-forming of micro glass cavities for MEMS wafer level hermetic packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Jintang Shang ; Key Lab. of MEMS, Southeast Univ., Nanjing, China ; Junwen Liu ; Chao Xu ; Di Zhang
more authors

Hermetic or vacuum packaging to maintain a controllable cavity pressure and low costs are required by many MEMS devices having moving parts. In this paper we propose a hot-forming process of fabricating micro glass cavity arrays for wafer-level and hermetic packaging of MEMS. First, the principle of the hot-forming process was discussed. Then, the hot-forming process for preparing cavity arrays in Pyrex7740 glass wafer was studied experimentally. After that, edge wrinkling of hot-formed wafers, hermetic wafer-level packaging, singulation of the wafer level cavity arrays were discussed. Results show that wafer-level packaged cavities were prepared, whose diameter was controllably between 200 microns and 2000 microns. It is also found that the hot-forming temperature and the processing time affect the filling rate of the glass. Results also show that edge wrinkling of hot-formed wafer could be removed by lowering the hot-forming temperature. It is then revealed that singulation of bonded wafers was achieved by low-cost laser drilling. Results show that the leakage rate of the packaged cavity is below 5Χ10−9 Pa. m / s.

Published in:

Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

Date of Conference:

1-4 June 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.