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Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

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6 Author(s)
Han, Y.D. ; Sch. of Mater. Sci. & Eng., Tianjin Univ., Tianjin, China ; Tan, C.M. ; Nai, S.M.L. ; Xu, L.Y.
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In this work, varying weight percentages of Ni-coated CNTs (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix to develop composite solders. The samples were extruded and characterized in terms of their thermal, wettability, microstructural, tensile and nano-mechanical properties. Our characterization results established that the composite technology coupled with nanotechnology in electronic solders can lead to 8% improvement in mechanical performance (in terms of 0.2% yield strength), 12% increase in the ultimate tensile strength and better creep behavior. With the addition of Ni-CNTs, there is no compromise on the melting point of the solder alloy and in fact a better wettability of the nanocomposite solders was observed. Thus, such a Ni-coated CNT filler in Sn-Ag-Cu solder provides a promising interconnect materials for microelectronics assembly and packaging industry.

Published in:

Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

Date of Conference:

1-4 June 2010