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This paper provided a new type vapor chamber coupled fin heat sink, which is applied to high power LED light source. It shows good performance for the heat dissipation of high power LED devices. To compare its performance, the same LED light source with only fin heat sink was also fabricated and tested. Experimental tests, numerical simulation and thermal resistance analysis were conducted on the two prototypes. The basic principle of vapor chamber, the experiment set-up and the detailed comparisons between the simulated results and the tests results were also presented in this paper. The results showed that the vapor chamber coupled fin heat sink could make the temperature of the fin base plate uniform, the thermal resistance of vapor chamber was as low as 0.05K/W. The fin heat sink assembled on vapor chamber demonstrated good heat removal capacity, indicating an overall thermal resistance of 0.654K/W at the ambient temperature of 27 °C.