Cart (Loading....) | Create Account
Close category search window
 

Integrating DICOM Information Model with Risk Management Process Area of CMMI for Radiotherapy Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Sim Hui Tee ; Fac. of Creative Multimedia, Multimedia Univ., Cyberjaya, Malaysia

Digital Imaging and Communications in Medicine (DICOM) provides a standard to facilitate interoperability among medical devices from the perspective of hardware and software. Though DICOM is widely adopted by medical device manufacturers, it does not specify risk management details in developing medical device software. This paper hypothesizes that this shortage of DICOM can be complemented by the risk management process area of CMMI® at maturity level 3. The objective of this research is to integrate DICOM information model with risk management process area of CMMI® for radiotherapy application. This research will enable the developers of radiotherapy applications to define and mitigate risks effectively.

Published in:

Computer Research and Development, 2010 Second International Conference on

Date of Conference:

7-10 May 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.