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3D Integration technology for energy efficient system design

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1 Author(s)
Shekhar Borkar ; Intel Corp., 2111 NE 25th Ave, JF2-04, Hillsboro, OR 97124, USA

CMOS scaling will continue, doubling transistor integration capacity every two years, providing billions of transistors to enable future novel systems. 3D integration technology will open the doors even further, changing the landscape and allowing integration of diverse functionality to realize energy-efficient and affordable complex systems that will continue to deliver higher performance. This paper presents how to exploit this new technology for energy efficient system design.

Published in:

VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on

Date of Conference:

26-28 April 2010