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Modeling and simulating the dynamic electrothermal behavior of power electronic circuits using bond graphs

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3 Author(s)
Garcia, J. ; Ecole Centrale de Lille, Villeneuve d''Ascq, France ; Dauphin Tanguy, G. ; Rombaut, C.

This paper describes the modeling of the electrical and thermal behavior of semiconductor switching devices using bond graphs. An effective way to identify the parameters of the thermal system is presented. The model shows good consistency with measurements of the junction temperature response in steady state as well as in transient state

Published in:

Power Electronics Specialists Conference, 1996. PESC '96 Record., 27th Annual IEEE  (Volume:2 )

Date of Conference:

23-27 Jun 1996