Cart (Loading....) | Create Account
Close category search window

Study of a 3D MEMS-based tactile vibration sensor for the use in middle ear surgery

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Arthaud, Y. ; TIMA Lab., CNRS, Grenoble, France ; Rufer, L. ; Mir, S.

This paper presents a micromachined vibration sensor working in the audible frequency range [1-5] kHz that is intended to be used during an ORL (Oto-Rhino-Laryngology) surgery. The sensor must give the surgeon feed back on his intervention related with the middle ear acoustic transmission properties by measuring the ossicles vibration amplitude. Since vibration amplitudes of the lightweight ossicles are very low (from 10 nm to 100 nm), high sensitivity and low mechanical impedance are required. The hand-held device will be easy to position on small middle-ear ossicles (millimeter scale). The use of such a device could be extended to other types of hand-held vibration measuring tools where a low mechanical impedance and high sensitivity are required. An electromechanical equivalent model is used to predict the influence of the sensor on the ossicular chain behaviour. A strain gauge that is suitable for this type of sensor is discussed. Finally, sensor dimensions and mechanical properties are optimised, taking into account specific constraints imposed by the human middle ear on the sensor dynamic behaviour.

Published in:

Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on

Date of Conference:

5-7 May 2010

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.