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Accurate Surface-to-Bulk Feature Alignment and Feature Size Preservation During Double-Sided Wafer Processing Using \hbox {C}_{4}\hbox {F}_{8} Plasma Polymer for the Fabrication of Electrostatically Actuated Cantilever Devices

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6 Author(s)
Rana, S. ; Diagnostic & Therapeutic Technol., Newcastle Univ., Newcastle upon Tyne, UK ; Gregoratto, I. ; Ortiz, P.M. ; Harris, A.J.
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An accurate alignment of surface-to-bulk features (within ±2 μm) during a double-sided silicon wafer processing can be extremely difficult. This is due to a combination of mask misalignment errors and unreliability of bulk etching techniques in translating the bulk feature shapes down to the surface side. In this paper, we present a fabrication process for an electrostatically actuated cantilever device where an accurate surface-to-bulk feature alignment is imperative to the operation of the device. The fabrication process compensates for the bulk etch-induced feature size variation and mask misalignment errors using a combination of self-aligning features and C4F8 plasma polymer passivation.

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Microelectromechanical Systems, Journal of  (Volume:19 ,  Issue: 4 )