By Topic

Multiparameter Sensitivity Analysis of Multiple Coupled Vias in Board and Package Structures for Early Design and Optimization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ying Li ; Electr. Eng. Dept., Univ. of Washington, Seattle, WA, USA ; Jandhyala, V.

Analytical expressions for the multiparametric sensitivity analysis of coupled-via S -parameters in board and package structures are derived in this paper. These expressions are validated with finite difference approximations of S-parameters obtained from three-dimensional field solvers and of the analytical expressions themselves. Sensitivity analysis with respect to multiple geometric and material variations provides quick early-design insight without resorting to complete three-dimensional field simulation. Sensitivities for eccentric effect of via drilling and exterior problem are also studied. First derivative data is also critical for gradient-based optimization of system-level performance which includes via-via coupling. The proposed approach is a stepping stone towards early design and optimization for large-scale via structures in microelectronics systems.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:33 ,  Issue: 4 )