Cart (Loading....) | Create Account
Close category search window
 

Ball Grid Array Solder Joint Reliability Under System-Level Compressive Load

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Tz-Cheng Chiu ; Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan ; Edwards, D. ; Ahmad, M.

Heatsinks have been widely used in the electronics industry as a thermal solution for high-performance and highpower-density devices. The thermal efficiency of heatsink solutions may be improved by increasing the compressive load applied on the interface between the electronic package and heatsink. Typical approaches for heatsink retention, however, would also lead to high levels of compressive load on the package ball grid array (BGA) solder joints. In this paper, the effect of compressive load on SnPbAg solder joint reliability is investigated by using both experimental and numerical approaches. Accelerated system-level solder joint reliability tests under temperature cycling and isothermal aging conditions, with the presence of compressive loads, are first performed to identify and characterize the critical reliability failure mode. Creep constitutive behavior under compression is then characterized and implemented in numerical finite-element simulations for developing a phenomenological model of the BGA solder joint failure under compressive loading. A life prediction formula for SnPbAg solder joint subject to constant compressive load is also proposed.

Published in:

Device and Materials Reliability, IEEE Transactions on  (Volume:10 ,  Issue: 3 )

Date of Publication:

Sept. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.