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Thermal Coupling Phenomena in IC's: Models for Analysis and Synthesis for Circuits based on Thermal Coupling

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2 Author(s)
V. Szekely ; Chair for Electron Devices, Technical University Budapest, 1521 Budapest, Hungary ; K. Tarnay

The lecture presents a modeling method for the combined electric-thermal effects of monolithic IC's. The method is compatible to the usual computer simulation techniques of electronic circuits. Typical application areas are: analysis of low frequency response of operational amplifiers, design of circuits with temperature-stabilized substrate, thermal functional circuits, etc.

Published in:

Solid State Circuits Conference, 1976. ESSCIRC 76. 2nd European

Date of Conference:

21-24 Sept. 1976