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Thermal Coupling Phenomena in IC's: Models for Analysis and Synthesis for Circuits based on Thermal Coupling

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2 Author(s)
Szekely, V. ; Dept. of Electron Devices, Tech. Univ. Budapest, Budapest, Hungary ; Tarnay, K.

The lecture presents a modeling method for the combined electric-thermal effects of monolithic IC's. The method is compatible to the usual computer simulation techniques of electronic circuits. Typical application areas are: analysis of low frequency response of operational amplifiers, design of circuits with temperature-stabilized substrate, thermal functional circuits, etc.

Published in:
Solid State Circuits Conference, 1976. ESSCIRC 76. 2nd European

Date of Conference: 21-24 Sept. 1976

Page(s):
54 - 55
INSPEC Accession Number:
12404777
Conference Location :
Toulouse
Product Type:
Conference Publications

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