By Topic

TEM Study on Diffusion Process of NiFe Schottky and MgO/NiFe Tunneling Diodes for Spin Injection in Silicon

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Jehyun Lee$^{1}$Institute of Solid State Physics, , Vienna University of Technology, , Vienna, Austria ; Thomas Uhrmann ; Theodoros Dimopoulos ; Hubert Bruckl
more authors

Analytical electron microscopy is employed to study the structural properties of NiFe Schottky diodes and NiFe/MgO tunneling diodes after annealing up to 400° C. Electrical characterization revealed a drop of the barrier height for the Schottky diodes, while the tunneling diodes are thermally stable. From the cross-sectional TEM images of the Schottky diodes, metal diffusion into Si substrate was found. Investigations of the diffusion using energy dispersive spectroscopy and energy filtered transmission electron microscopy revealed that Ni diffused into the Si substrate to form nickel silicide. Moreover, in some cases, the gold capping layer also diffused into the substrate even deeper than Ni. In the case of the tunneling diodes, metal diffusion was inhibited by the presence of MgO.

Published in:

IEEE Transactions on Magnetics  (Volume:46 ,  Issue: 6 )